Places and Things

Qualcomm has announced a second-generation version of its ultrasonic in-display fingerprint sensor, the 3D Sonic Max, that promises to fix the issues with the original 3D Sonic Sensor by offering a sensor that’s 17 times bigger. from https://www.theverge.com/circuitbreaker/2019/12/3/20992625/qualcomm-ultrasonic-fingerprint-reader-2-fingers-17-times-larger-scanning-problem-fixes https://cdn.vox-cdn.com/uploads/chorus_image/image/65819163/3dsonic_max.0.png

According to a report by WinFuture, Qualcomm is planning another new chipset for Wear OS devices, — even though the existing Wear 3100 has barely materialized. from https://www.androidpolice.com/2019/07/09/qualcomm-may-finally-deliver-a-smartwatch-processor-that-doesnt-suck/ http://ifttt.com/images/no_image_card.png